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Tutorial Presentation Peak Fitting of X-ray Photoelectron Spectroscopy Spectral Data
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Tue, Mar 31, 2026
1:30 PM – 2:30 PM MDT (GMT-6)
Boulder Hall, room 200
1435 W University Dr., Boise, ID 83706, United States
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of a sample, including qualitative/quantitative elemental analysis and information on the
chemical bonding states of those elements. In cases where peak overlaps are present within an
XPS spectrum, computational peak fitting may be used to deconvolute an overlapping spectral
feature into its component peaks. Although the actual peak fitting is performed by a computer,
providing the appropriate fitting parameters and determining if the resultant fit is reasonable
requires considerable knowledge and experience on the part of the analyst. Dr. Zhuang will be
providing a tutorial on the art of XPS peak fitting based upon his decades of experience in this
area.
Where
Boulder Hall, room 200
1435 W University Dr., Boise, ID 83706, United States
Speakers
Kent Zhuang
Distinguished Member of the Technical Staff
Micron Technology
Dr. Kent Zhuang received a B.S. degree in chemistry from the University of Science and Technology of China (Hefei, China) in 1988, an M.S. degree in polymer chemistry from the Institute of Chemistry, Chinese Academy of Science (Beijing, China) in 1991, and a Ph.D. degree in analytical chemistry from the State University of New York at Buffalo (Buffalo, New York, USA) in 1996. From 1997 to 2006, he worked as a Senior Surface Scientist and later a Principal Surface Scientist at Eastman Kodak, Rochester, NY, specializing in surface analysis. He joined Micron in 2006 and is currently a Distinguished Member of the Technical Staff in the Corporate Laboratories. His current research interests focus on thin film metrology development pertaining to metals, semiconductors, high-K and charge trap materials. Dr. Zhuang holds 5 U.S. and European patents and has received 5 Micron innovation awards. He has authored or co-authored 38 external scientific and technical publications and 36 Micron TLP journal papers.